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Q03UDCPU Universal Model Redundant Power Supply Module Mitsubishi 30 K Steps

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Q03UDCPU Universal Model Redundant Power Supply Module Mitsubishi 30 K Steps

Large Image :  Q03UDCPU Universal Model Redundant Power Supply Module Mitsubishi 30 K Steps

Product Details:

Place of Origin: Japan
Brand Name: MITSUBISHI
Certification: CE
Model Number: Q03UDCPU

Payment & Shipping Terms:

Minimum Order Quantity: 1
Price: Contact
Packaging Details: new and original
Delivery Time: 5-7 days
Payment Terms: T/T, Western Union,paypal
Supply Ability: 1000
Detailed Product Description
Brand: MITSUBISHI Modenl Number: Q03UDCPU
Country Of Origin: Japan Program Capacity: 30 K Steps
Basic Operation Processing Speed (LD Instruction): 0.12 μs Input: 100 To 240 V AC
Output: 5 V DC/3 A Type: Redundant Power Supply Module
Output Current: 10A Humidity: 5 To 95% (non-condensing)
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Q03UDCPU Universal model Redundant Power Supply Module Mitsubishi 30 k steps

 


 

Q03UDCPU Description​

The Mitsubishi Q03UDCPU is a ​​general-purpose, high-performance CPU module​​ belonging to the Mitsubishi MELSEC Q series. It is designed for complex industrial automation applications, offering a balance of substantial program capacity, high-speed processing, and versatile communication capabilities. It is well-suited for controlling manufacturing production lines, machinery automation, and other processes requiring reliable and efficient programmable control

 

Q03UDCPU Features​

  • ​High-Speed Processing:​​ Executes basic instructions rapidly, with a LD instruction processing speed of 20 ns and a MOV instruction at 40 ns, enabling quick response and short cycle times in demanding applications

    .

     

  • ​Large Memory Capacity:​​ Features a ​​30K-step program capacity​​ (120 KB program memory) for handling complex control logic and large-scale programs

    .

     

  • ​Versatile Programming Support:​​ Supports multiple programming languages including ladder logic (Relay Symbol Language), logic symbols, MELSAP3 (SFC), MELSAP-L, Function Block (FB), and Structured Text (ST), providing flexibility for programmers

    .

     

  • ​Multiple Communication Ports:​​ Equipped with a ​​USB port​​ for convenient connection to programming tools (like GX Works2) and an ​​RS-232 interface​​ for serial communication with other devices such as HMIs, bar code readers, or inverters

    .

     

  • ​Multi-CPU System Support:​​ Can be configured in a multi-CPU system within a single base unit, allowing complex control tasks to be divided and processed by different specialized CPUs (e.g., motion, PC), enhancing system performance and integration

    .

     

  • ​Data Backup and Reliability:​​ Features functions like ​​automatic writing to standard ROM​

    and supports memory cards for data backup, helping to prevent data loss due to power failures or battery depletion and ensuring program and parameter integrity.

     

  • ​Remote I/O Network Support:​​ Compatible with MELSECNET/H remote I/O networks, enabling distributed control over a wide area and simplifying wiring in large systems

    .

     

  • ​Compact Design:​​ Its slim form factor (27.4mm wide) helps save space in control panels.

     

Q03UDCPU Material Applications​

While the provided search results do not detail the specific materials used in the construction of the Q03UDCPU module itself, central processing units (CPUs) and electronic components typically utilize a variety of materials for different functions

:

 

  • ​Semiconductors (Silicon):​​ The core integrated circuit (IC) chips, including the microprocessor, are primarily made from silicon, which is the fundamental material for transistors and microchips due to its semiconductor properties

  • ​Conductive Materials (Copper, Gold):​​ ​​Copper​​ is widely used for internal wiring and traces on printed circuit boards (PCBs) due to its excellent electrical conductivity. ​​Gold​​ plating might be used on connector pins and critical contacts for its superior corrosion resistance, oxidation resistance, and reliable electrical connection

    .

     

  • ​Structural and Cooling Components (Aluminum, Plastics):​​ The module's housing or heat spreader may be made from ​​aluminum​​ due to its good thermal conductivity, which helps dissipate heat generated during operation. Various

  • ​engineering plastics​​ are likely used for the outer casing to provide insulation, structural support, and protection for the internal electronics

    .

     

Q03UDCPU Key Parameters​

Here are the crucial technical specifications for the Mitsubishi Q03UDCPU presented in a table:

Parameter Category

Specification

Value / Description

​Program Capacity​ Program Steps

30 K steps

 

​Memory Capacity​ Program Memory

120 KB

 

​Processing Speed​ LD Instruction

20 ns

  MOV Instruction

40 ns

 

​I/O Capacity​ Maximum I/O Points (physical)

4096 points

 

  Maximum Software I/O Points (X/Y)

8192 points

 

​Communication Ports​ Programming Port

USB

 

  Serial Port

RS-232

 

​Constant Scan​ Setting Range

0.5 ~ 2000 ms

 

​Power Supply​ Internal Current Consumption (DC5V)

0.33 A

 

​Physical Dimensions​ Height (H) x Width (W) x Depth (D)

98 mm x 27.4 mm x 89.3 mm

 

​Weight​
 

Specifications:

 

 

Attribute Value
For Use With MELSEC Q Series
Number of I/O 2048
Manufacturer Series MELSEC Q
Input Type Analogue, Digital
Voltage Category 5 V dc
Output Type Analogue, Digital
Communication Port Type RS232C
Program Capacity 32 kB
Programming Interface Computer, Operating Panel
Length 89.3mm
Maximum Inputs/Outputs 8192
Number of Communication Ports 1
Width 27.4mm
Maximum Operating Temperature +55°C
Dimensions 89.3 x 27.4 x 98 mm
Depth 98mm
Battery Backup Yes
Minimum Operating Temperature 0°C
Mounting Type DIN Rail
Memory 94 kB
 

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