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Q03UDCPU Universal Model Redundant Power Supply Module Mitsubishi 30 K Steps
Product Details:
| Place of Origin: | Japan |
| Brand Name: | MITSUBISHI |
| Certification: | CE |
| Model Number: | Q03UDCPU |
Payment & Shipping Terms:
| Minimum Order Quantity: | 1 |
|---|---|
| Price: | Contact |
| Packaging Details: | new and original |
| Delivery Time: | 5-7 days |
| Payment Terms: | T/T, Western Union,paypal |
| Supply Ability: | 1000 |
|
Detail Information |
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| Brand: | MITSUBISHI | Modenl Number: | Q03UDCPU |
|---|---|---|---|
| Country Of Origin: | Japan | Program Capacity: | 30 K Steps |
| Basic Operation Processing Speed (LD Instruction): | 0.12 μs | Input: | 100 To 240 V AC |
| Output: | 5 V DC/3 A | Type: | Redundant Power Supply Module |
| Output Current: | 10A | Humidity: | 5 To 95% (non-condensing) |
| Highlight: | plc power supply module,diode redundancy module |
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Product Description
Q03UDCPU Universal model Redundant Power Supply Module Mitsubishi 30 k steps
Q03UDCPU Description
The Mitsubishi Q03UDCPU is a general-purpose, high-performance CPU module belonging to the Mitsubishi MELSEC Q series. It is designed for complex industrial automation applications, offering a balance of substantial program capacity, high-speed processing, and versatile communication capabilities. It is well-suited for controlling manufacturing production lines, machinery automation, and other processes requiring reliable and efficient programmable control
Q03UDCPU Features
- •
High-Speed Processing: Executes basic instructions rapidly, with a LD instruction processing speed of 20 ns and a MOV instruction at 40 ns, enabling quick response and short cycle times in demanding applications
. - •
Large Memory Capacity: Features a 30K-step program capacity (120 KB program memory) for handling complex control logic and large-scale programs
. - •
Versatile Programming Support: Supports multiple programming languages including ladder logic (Relay Symbol Language), logic symbols, MELSAP3 (SFC), MELSAP-L, Function Block (FB), and Structured Text (ST), providing flexibility for programmers
. - •
Multiple Communication Ports: Equipped with a USB port for convenient connection to programming tools (like GX Works2) and an RS-232 interface for serial communication with other devices such as HMIs, bar code readers, or inverters
. - •
Multi-CPU System Support: Can be configured in a multi-CPU system within a single base unit, allowing complex control tasks to be divided and processed by different specialized CPUs (e.g., motion, PC), enhancing system performance and integration
. - •
Data Backup and Reliability: Features functions like automatic writing to standard ROM
and supports memory cards for data backup, helping to prevent data loss due to power failures or battery depletion and ensuring program and parameter integrity. - •
Remote I/O Network Support: Compatible with MELSECNET/H remote I/O networks, enabling distributed control over a wide area and simplifying wiring in large systems
. - •
Compact Design: Its slim form factor (27.4mm wide) helps save space in control panels.
Q03UDCPU Material Applications
While the provided search results do not detail the specific materials used in the construction of the Q03UDCPU module itself, central processing units (CPUs) and electronic components typically utilize a variety of materials for different functions
:
- •
Semiconductors (Silicon): The core integrated circuit (IC) chips, including the microprocessor, are primarily made from silicon, which is the fundamental material for transistors and microchips due to its semiconductor properties
- •
Conductive Materials (Copper, Gold): Copper is widely used for internal wiring and traces on printed circuit boards (PCBs) due to its excellent electrical conductivity. Gold plating might be used on connector pins and critical contacts for its superior corrosion resistance, oxidation resistance, and reliable electrical connection
. - •
Structural and Cooling Components (Aluminum, Plastics): The module's housing or heat spreader may be made from aluminum due to its good thermal conductivity, which helps dissipate heat generated during operation. Various
-
engineering plastics are likely used for the outer casing to provide insulation, structural support, and protection for the internal electronics
.
Q03UDCPU Key Parameters
Here are the crucial technical specifications for the Mitsubishi Q03UDCPU presented in a table:
Specifications:
| Attribute | Value |
|---|---|
| For Use With | MELSEC Q Series |
| Number of I/O | 2048 |
| Manufacturer Series | MELSEC Q |
| Input Type | Analogue, Digital |
| Voltage Category | 5 V dc |
| Output Type | Analogue, Digital |
| Communication Port Type | RS232C |
| Program Capacity | 32 kB |
| Programming Interface | Computer, Operating Panel |
| Length | 89.3mm |
| Maximum Inputs/Outputs | 8192 |
| Number of Communication Ports | 1 |
| Width | 27.4mm |
| Maximum Operating Temperature | +55°C |
| Dimensions | 89.3 x 27.4 x 98 mm |
| Depth | 98mm |
| Battery Backup | Yes |
| Minimum Operating Temperature | 0°C |
| Mounting Type | DIN Rail |
| Memory | 94 kB |
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